The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Jul. 21, 2023
Applicant:
The Regents of the University of California, Oakland, CA (US);
Inventors:
Muchen Xu, Los Angeles, CA (US);
Chang-Jin Kim, Beverly Hills, CA (US);
Assignee:
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, Oakland, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 99/00 (2010.01); B63B 1/38 (2006.01); B81B 1/00 (2006.01); C25B 5/00 (2006.01); F15D 1/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81C 99/0085 (2013.01); B63B 1/38 (2013.01); B81B 1/006 (2013.01); C25B 5/00 (2013.01); F15D 1/003 (2013.01); F15D 1/0065 (2013.01); B63B 2001/387 (2013.01); B81B 7/0061 (2013.01); F15D 1/0085 (2013.01);
Abstract
A method of forming a microstructured surface includes the operations of depositing electrodes on a surface of a substrate and securing a mold against the surface of the substrate containing the electrodes with a tight contact with the electrodes, the mold containing a plurality of cavities therein. Pressure is applied between the mold and the substrate to force material from the substrate into the plurality of cavities around the electrodes to form a plurality of microfeatures. The mold is separated from the substrate.