The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Aug. 13, 2021
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Masakazu Fukumitsu, Nagaokakyo, JP;
Yoshiyuki Higuchi, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); H03H 3/007 (2006.01); H10N 30/00 (2023.01);
U.S. Cl.
CPC ...
B81C 1/00301 (2013.01); H03H 3/0072 (2013.01); H10N 30/706 (2024.05); B81B 2201/0271 (2013.01); B81B 2207/093 (2013.01); B81B 2207/095 (2013.01);
Abstract
A resonance device that includes a MEMS substrate that includes a resonator, a top cover having a silicon oxide film on a surface thereof that faces the MEMS substrate, and a bonding part that bonds the MEMS substrate and the top cover to each other so as to seal a vibration space of the resonator. The silicon oxide film includes a through hole that is formed along at least part of the periphery of the vibration space when the top cover is viewed in a plan view and that penetrates to a surface of the top cover. The through hole includes a first metal layer.