The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

Jun. 09, 2022
Applicant:

Menlo Microsystems, Inc., Irvine, CA (US);

Inventors:

Xu Zhu, Belmont, MA (US);

Hajime Terazawa, Carlsbad, CA (US);

Chris Nassar, Ballston Spa, NY (US);

Assignee:

Menlo Microsystems, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 59/00 (2006.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0018 (2013.01); B81B 2201/018 (2013.01); B81B 2207/053 (2013.01); H01H 59/0009 (2013.01);
Abstract

A micro-relay switch array may comprise an array of micro-relays disposed on a substrate, and a cap disposed over the array of micro-relays, thereby encapsulating the array of micro-relays. The micro-relay switch array may further comprise an array of through-substrate vias (TSVs) associated with the array of micro-relays, arranged such that columns of TSVs alternate with columns of micro-relays, and a plurality of device electrical conductors, each of which electrically couples one of the TSVs of the array of TSVs directly to at least two of the micro-relays. The micro-relay switch array may further comprise a plurality of TSV electrical conductors, each of which electrically couples at least two TSVs together. Each micro-relay of the array of micro-relays may be a micro-electromechanical system (MEMS) switch. The substrate and cap may be glass, and the TSVs may be through-glass vias.


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