The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
May. 04, 2020
U.s. Army Combat Capabilities Development Command, Army Research Laboratory, Adelphi, MD (US);
Jorge A. Cardenas, Durham, NC (US);
Nathan S. Lazarus, North Bethesda, MD (US);
Harvey H. Tsang, Rockville, MD (US);
The United States of America as represented by the Secretary of the Army, Washington, DC (US);
Abstract
Photonic annealing is used to treat electrically-conductive thermoplastic. The thermoplastic forms, partially or wholly, a part which may be formed by additive manufacturing, like fused filament fabrication (FFF). The photonic annealing improves part conductivity and also alter, enhance, or give rise to other material properties while taking significantly less time than other conventional post-process methods. For instance, the baseline conductivity of the electrically-conductive thermoplastic material may be on the order of 10S/m or lower. After the photonic annealing, its conductivity may be raised to the order of 10-10S/m or more. This represents an improvement of 10-100× or even more of conductivity of the electrically-conductive thermoplastic compared to electrically-conductive thermoplastic prior to the photonic annealing.