The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

Nov. 30, 2022
Applicant:

The Texas A&m University System, College Station, TX (US);

Inventors:

Anubhav Sarmah, Bryan, TX (US);

Ava Crowley, College Station, TX (US);

Suchi Desai, College Station, TX (US);

Gabriel Zolton, Kingwood, TX (US);

Micah J. Green, College Station, TX (US);

Assignee:

The Texas A&M University System, College Station, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/295 (2017.01); B29C 64/118 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 70/10 (2020.01); B29K 101/10 (2006.01); B29K 105/16 (2006.01); B29K 507/04 (2006.01);
U.S. Cl.
CPC ...
B29C 64/295 (2017.08); B29C 64/118 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/10 (2020.01); B29K 2101/10 (2013.01); B29K 2105/162 (2013.01); B29K 2507/04 (2013.01);
Abstract

In an embodiment, the present disclosure pertains to a method of direct ink writing (DIW). In general, the method includes extruding a resin from a print head, applying radio frequency (RF) heating to the resin, and inducing partial curing of the extruded resin layer-by-layer to thereby form a self-supporting structure. In an additional embodiment, the present disclosure pertains to a system for DIW. In some embodiments, the system includes a print head operable to extrude a resin from a nozzle and an RF applicator.


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