The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

Feb. 28, 2023
Applicant:

Lpkf Laser & Electronics Ag, Garbsen, DE;

Inventors:

Robin Alexander Krueger, Hannover, DE;

Norbert Ambrosius, Kevelaer, DE;

Roman Ostholt, Langenhagen, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/382 (2014.01); B23K 26/00 (2014.01); B23K 26/0622 (2014.01); B23K 26/064 (2014.01); B23K 26/402 (2014.01); B23K 26/53 (2014.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
B23K 26/382 (2015.10); B23K 26/0006 (2013.01); B23K 26/0624 (2015.10); B23K 26/064 (2015.10); B23K 26/402 (2013.01); B23K 26/53 (2015.10); H01L 21/486 (2013.01); B23K 2101/40 (2018.08); B23K 2103/50 (2018.08); B23K 2103/54 (2018.08); B23K 2103/56 (2018.08); H01L 23/147 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01);
Abstract

A substrate comprises glass, sapphire, silicon and/or aluminosilicate, and has at least one recess or through-opening. The at least one recess or through-opening is formed by anisotropic removal of substrate material by etching a portion of the substrate that has been modified by a pulse of laser radiation in a direction of a thickness of the substrate. The modified portion of the substrate extends along a beam axis of the laser radiation. The pulse of laser radiation was applied with a focus extending from a first focal depth positioned past one side of the substrate to a second focal depth located at an opposite side of the substrate.


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