The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Feb. 15, 2023
Asahi Kasei Kabushiki Kaisha, Tokyo, JP;
Moulage Llc, Tokyo, JP;
ASAHI KASEI KABUSHIKI KAISHA, Tokyo, JP;
MOULAGE LLC, Tokyo, JP;
Abstract
An object is to provide a composition for use in sintered molded bodies that enables an organic binder to be degreased in a short time without requiring a special facility or step, does not cause mold deposit during molding, and suppresses cracking and swelling during molding and after sintering. In order to achieve the above-mentioned object, the present disclosure is a composition for use in sintered molded bodies containing a sinterable inorganic powder and an organic binder, wherein the organic binder contains at least a polyacetal resin, a polyolefin resin and an epoxy resin, and a total end amount with respect to all polyoxymethylene units in the polyacetal resin is 0.1 mol % or more and 0.75 mol % or less.