The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Aug. 04, 2021
Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Peng Chen, Beijing, CN;

Kuo Sun, Beijing, CN;

Ziru Zhao, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10K 59/38 (2023.01); G06V 40/13 (2022.01); H10K 50/84 (2023.01); H10K 50/86 (2023.01); H10K 59/123 (2023.01); H10K 59/40 (2023.01); H10K 59/60 (2023.01); H10K 59/80 (2023.01); H10K 71/00 (2023.01); H10K 59/12 (2023.01); H10K 59/65 (2023.01);
U.S. Cl.
CPC ...
H10K 59/38 (2023.02); G06V 40/1318 (2022.01); H10K 50/84 (2023.02); H10K 50/865 (2023.02); H10K 59/123 (2023.02); H10K 59/40 (2023.02); H10K 59/60 (2023.02); H10K 59/8792 (2023.02); H10K 71/00 (2023.02); H10K 59/1201 (2023.02); H10K 59/65 (2023.02); H10K 59/8731 (2023.02);
Abstract

A display panel, a manufacturing method therefor, and a display device. The display panel comprising: a base substrate; a plurality of light emitting devices on the base substrate; an encapsulation layer on a side of the light emitting devices away from the base substrate, configured for encapsulating the plurality of light emitting devices; a photosensitive sensor on a side of the light emitting devices away from the encapsulation layer; a color film layer on a side of the encapsulation layer away from the base substrate, comprising a plurality of color film elements; and a light-shielding layer on a side of the encapsulation layer away from the base substrate, comprising a plurality of first openings and a plurality of second openings, the second openings each being filled with a filter element, and the second openings each being used for transmitting light reflected by a finger toward the photosensitive sensor.


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