The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Aug. 14, 2017
Applicant:
Creeled, Inc., Durham, NC (US);
Inventor:
Christopher P. Hussell, Cary, NC (US);
Assignee:
CreeLED, Inc., Durham, NC (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/58 (2010.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 33/62 (2010.01); H10H 20/852 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01); H01L 23/00 (2006.01); H10H 20/01 (2025.01); H10H 20/853 (2025.01); H10H 20/854 (2025.01); H10H 20/855 (2025.01);
U.S. Cl.
CPC ...
H10H 20/856 (2025.01); H01L 25/0753 (2013.01); H10H 20/852 (2025.01); H10H 20/857 (2025.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/181 (2013.01); H10H 20/0362 (2025.01); H10H 20/0363 (2025.01); H10H 20/853 (2025.01); H10H 20/854 (2025.01); H10H 20/855 (2025.01);
Abstract
Light emitting diode (LED) devices, methods and systems are provided. An example apparatus can include an underfill layer separate from a bonding layer. The apparatus can further include a dark encapsulating layer comprising an epoxy-molded compound which is applied using a powder-coating process. A method for providing a powder-coated encapsulation and for producing an LED panel with such an encapsulant is disclosed.