The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Oct. 21, 2022
Lite-on Opto Technology (Changzhou) Co., Ltd., Changzhou, CN;
Lite-on Technology Corporation, Taipei, TW;
Wei-Te Cheng, Taipei, TW;
Kuo-Ming Chiu, New Taipei, TW;
Kai-Chieh Liang, New Taipei, TW;
Jie-Ting Tsai, New Taipei, TW;
LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., Changzhou, CN;
LITE-ON TECHNOLOGY CORPORATION, Taipei, TW;
Abstract
A method of manufacturing the light emitting package structure is provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substrate; a cover-enclosing process: disposing a cover element having a second joint area on the substrate, the first joint area and the second joint area joined to each other by the sealant; a vacuum process: reducing an ambient pressure to a first pressure lower than the original ambient pressure; a pressure-adjusting process: adjusting the ambient pressure around the package structure to a second pressure higher than the first pressure; and a curing process: curing the sealant.