The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Nov. 21, 2023
Applicant:

Japan Display Inc., Tokyo, JP;

Inventors:

Hajime Watakabe, Tokyo, JP;

Akihiro Hanada, Tokyo, JP;

Marina Mochizuki, Tokyo, JP;

Ryo Onodera, Tokyo, JP;

Fumiya Kimura, Tokyo, JP;

Isao Suzumura, Tokyo, JP;

Assignee:

JAPAN DISPLAY INC., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/18 (2025.01); H10F 39/00 (2025.01);
U.S. Cl.
CPC ...
H10F 39/18 (2025.01); H10F 39/014 (2025.01); H10F 39/8033 (2025.01); H10F 39/811 (2025.01);
Abstract

The present invention provides a technology which realizes a reliable semiconductor device including a photosensor device by preventing pent roofs of edges of a Player from being generated and a metal wiring installed over the Player from coming down while securing the electrical conductivity of the Player. The semiconductor device includes a photosensor including a photodiode formed on a substrate. The photodiode includes: a cathode electrode; a laminated structure that is formed on the cathode electrode and in which an Nlayer, an I layer, and a Player are laminated in this order; an anode electrode formed on the Player; a first insulating film formed so as to cover a portion of the anode electrode and edges of the laminated structure; and a metal wiring connected to the anode electrode. The edges of the laminated structure are formed in forward tapered shapes in a cross-sectional view.


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