The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Dec. 15, 2022
Applicant:

Ezconn Corporation, New Taipei, TW;

Inventors:

Li Chan Yan, New Taipei, TW;

Ming-Ching Chen, New Taipel, TW;

Assignee:

EZCONN CORPORATION, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 1/20 (2006.01); H03H 1/00 (2006.01); H05K 1/02 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1427 (2013.01); H01P 1/20 (2013.01); H03H 1/0007 (2013.01); H05K 1/0277 (2013.01);
Abstract

Some embodiments of the disclosure provide an isolator which includes a body, a first circuit module, and a second circuit module. In some examples, the first circuit module is arranged at a first connecting port of the body and includes a first integrated circuit board, a first shell surrounding the first integrated circuit board, a first signal processing circuit penetrating through the first integrated circuit board, and a joint sleeved on an insulating bushing. The joint partially surrounds the first signal processing circuit. A first end portion of the first signal processing circuit is electrically connected to a first contact element. The second circuit module is arranged at a second connecting port of the body and includes a second integrated circuit board, a second shell surrounding the second integrated circuit board, and a second signal processing circuit extending along a length direction of the second integrated circuit board.


Find Patent Forward Citations

Loading…