The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

May. 14, 2024
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Raymond P. Johnston, Lake Elmo, MN (US);

Kevin W. Gotrik, Hudson, WI (US);

John J. Sullivan, Hudson, WI (US);

Kenneth A. P. Meyer, Eagan, MN (US);

Joseph C. Carls, Austin, TX (US);

Haiyan Zhang, Lake Elmo, MN (US);

Gregory L. Abraham, Austin, TX (US);

Matthew S. Stay, Bloomington, MN (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01Q 1/38 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/20 (2006.01); H05K 3/24 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H01Q 1/38 (2013.01); H05K 1/0353 (2013.01); H05K 3/0014 (2013.01); H05K 3/103 (2013.01); H05K 3/207 (2013.01); H05K 3/244 (2013.01); H05K 3/4644 (2013.01); H05K 2201/09118 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/0723 (2013.01);
Abstract

A patterned conductive article includes a substrate having a first groove therein; a conductive seed layer disposed in the first groove; and a unitary conductive body disposed at least partially in the first groove. The conductive seed layer covers at least a majority of a bottom surface of the first groove, and the unitary conductive body covers the conductive seed layer and at least a majority of side surfaces of the first groove. In a plane through the unitary conductive body that is parallel to and separate from the conductive seed layer, the unitary conductive body has a lower first line edge roughness at a first interface with the side surfaces and the conductive seed layer has a higher second line edge roughness at an edge of the conductive seed layer.


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