The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Nov. 08, 2021
Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Xianlei Bi, Beijing, CN;
Xun Yao, Beijing, CN;
Jianjun Wu, Beijing, CN;
Chuanyan Lan, Beijing, CN;
Qian Ma, Beijing, CN;
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Abstract
A flexible printed circuit includes a substrate, a first conductive layer, and a first protective layer. The substrate has a body region, a first bonding region, and a connection region located between the body region and the first bonding region. The first conductive layer is located on a first side of the substrate, and extends from the body region to the first bonding region via the connection region. The first protective layer is located on a side of the first conductive layer away from the substrate, and extends from the body region to the connection region. The first protective layer partially covers the connection region.