The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Jun. 02, 2023
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventors:
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H05K 1/147 (2013.01); H05K 1/185 (2013.01); H05K 9/0084 (2013.01); H05K 2201/0707 (2013.01);
Abstract
To provide circuit module capable of shielding electromagnetic wave passing not only on side of electronic component but also below electronic component. Circuit module according to present disclosure includes main board, one first electronic component mounted on main board, and submodule mounted on main board. Submodule includes sub board, and second electronic component. Sub board includes bottom plate mounted on main board, and side plate extending upward from bottom plate. Second electronic component is mounted upper surface of bottom plate. Shield pattern are formed on lower surface of bottom plate, and outer side surface of side plate.