The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Jun. 02, 2022
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Dae Jin Shim, Suwon-si, KR;
Jung Jin Park, Suwon-si, KR;
Su Min Kim, Suwon-si, KR;
Jong Ho Lee, Suwon-si, KR;
Eun Jung Lee, Suwon-si, KR;
Jung Jin Park, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05F 1/00 (2006.01); H01G 4/30 (2006.01); H01G 13/00 (2013.01);
U.S. Cl.
CPC ...
H05F 1/00 (2013.01); H01G 13/00 (2013.01); H01G 4/30 (2013.01);
Abstract
A film for manufacturing an electronic component includes: a polymer layer; and metal nanowires dispersed in the polymer layer. The polymer layer may include a polyester-based compound such as polyethylene terephthalate. The metal nanowire may include a ferromagnetic metal such as at least one of nickel (Ni), cobalt (Co), and iron (Fe), or alloys thereof.