logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12363406 B1

PDFFull Text
Date of Patent:
Jul. 15, 2025

Filed:

Aug. 02, 2022

Camera module for heat dissipation and ground and electronic device including the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Minki Cho, Suwon-si, KR;

Jungsoo Kim, Suwon-si, KR;

Dohyun Ahn, Suwon-si, KR;

Wonchul Cho, Suwon-si, KR;

Taeyun Kim, Suwon-si, KR;

Wonjun Jeong, Suwon-si, KR;

Kwangsic Choi, Suwon-si, KR;

Chonguk Heo, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Nixon & Vanderhye, P.C.

Primary Examiner:

Twyler L Haskins

Assistant Examiner:

Akshay Trehan

Int. Cl.
CPC ...
H04N 23/52 (2023.01); G03B 5/00 (2021.01); G03B 17/02 (2021.01); G03B 17/55 (2021.01); G03B 30/00 (2021.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H04N 23/52 (2023.01); G03B 17/02 (2013.01); G03B 17/55 (2013.01); G03B 30/00 (2021.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01); H05K 1/0218 (2013.01); H05K 7/20 (2013.01); H05K 7/20509 (2013.01); H05K 9/00 (2013.01); H05K 9/0024 (2013.01); G03B 5/00 (2013.01); H05K 1/147 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A camera module includes: a printed circuit board having a conductive pad exposed on one surface of the printed circuit board, an image sensor disposed on the printed circuit board, a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad, an actuator disposed above the image sensor and configured to adjust a position of a lens assembly, and a shield can surrounding the actuator and electrically connected to the conductive plate. The conductive plate is configured to emit heat generated from the image sensor to the outside of the camera module by contact with the image sensor.

Find Patent Forward Citations

Loading…