The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Nov. 08, 2023
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Hayato Nakano, Kofu, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01L 23/057 (2006.01); H01L 23/31 (2006.01); H01L 23/52 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 21/56 (2013.01); H01L 23/057 (2013.01); H01L 23/3107 (2013.01); H01L 24/73 (2013.01); H01L 2224/73221 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A semiconductor device including a semiconductor chip, an insulating circuit board having a circuit pattern formed on an insulating plate, a case including a frame part having an opening that is substantially rectangular in a plan view of the semiconductor device, inner wall surfaces of the frame part at the opening forming a storage part to store the insulating circuit board, and a printed circuit board which has a flat plate shape and which protrudes from one of the inner wall surfaces of the frame part toward the storage part. The semiconductor device further includes a sealing material filled in the storage part, to thereby seal the semiconductor chip and the printed circuit board. A front surface of the sealing material forms a sealing surface, and in a thickness direction of the semiconductor chip, the sealing surface is higher around the printed circuit board than around the semiconductor chip.


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