The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Jun. 28, 2022
SK Hynix Inc., Icheon-si, KR;
Seong Hwi Song, Icheon-si, KR;
SK hynix Inc., Icheon-si, KR;
Abstract
A stack type semiconductor device including a first wafer and a second wafer. The first wafer including at least one first chip. The second wafer including at least one second chip electrically connected with the first chip. Each of the first and second chips including a test circuit block, at least one test bonding pad and a hybrid boning member. The test circuit block performing a test operation based on a test signal. The test bonding pad arranged on a bonding surface of each of the first and second chips to transmit the test signal and signals for driving the test circuit block between the first and second chips. The hybrid bonding member electrically connected between the test bonding pads.