The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Oct. 14, 2021
Applicant:
Qromis, Inc., Santa Clara, CA (US);
Inventors:
Ozgur Aktas, Pleasanton, CA (US);
Vladimir Odnoblyudov, Danville, CA (US);
Cem Basceri, Los Gatos, CA (US);
Assignee:
Qromis, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); H01L 23/367 (2006.01); H01L 23/528 (2006.01); H10D 62/85 (2025.01); H10D 84/01 (2025.01); H10D 84/05 (2025.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4871 (2013.01); H01L 21/7806 (2013.01); H01L 23/367 (2013.01); H01L 23/5286 (2013.01); H10D 62/8503 (2025.01); H10D 84/01 (2025.01); H10D 84/05 (2025.01); H01L 2223/6683 (2013.01);
Abstract
A monolithic microwave integrated circuit (MMIC) system includes a growth substrate, a device layer coupled to the growth substrate, a plurality of MMIC device elements coupled to the device layer, and a plurality of metallization structures coupled to the plurality of MMIC device elements. The MMIC system also includes a carrier substrate coupled to the plurality of metallization structures and a cooling structure coupled to the carrier substrate.