The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Oct. 21, 2021
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Daisuke Kawabata, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 19/80 (2025.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01L 23/10 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 25/072 (2013.01);
Abstract
Object is to reduce the number of paths through which moisture enters in a semiconductor device. A semiconductor device includes a semiconductor element, a case housing the semiconductor element, a sealing material filled in the case, a low moisture permeable sheet covering the sealing material, and a lid covering an opening of the case. The low moisture permeable sheet is made of a low moisture permeable material having moisture permeability of 1 g/m×24 Hr or less. The low moisture permeable sheet is interposed, at the peripheral edge thereof, between the case and the lid.