The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Aug. 16, 2022
Applicant:

Nuvoton Technology Corporation, Hsinchu, TW;

Inventors:

Uri Trichter, Hsinchu, TW;

Tsung-Hsueh Li, Yunlin County, TW;

Dan Morav, Hsinchu, TW;

Benny Shatit, Hsinchu, TW;

Lior Albaz, Or Yehuda, IL;

Ming-Che Hung, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); G06F 1/14 (2006.01); G06F 1/30 (2006.01); G06F 21/55 (2013.01); G06F 21/87 (2013.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H03K 3/84 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); G06F 1/14 (2013.01); G06F 1/30 (2013.01); G06F 21/554 (2013.01); G06F 21/87 (2013.01); H01L 23/3107 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H03K 3/84 (2013.01); G06F 2221/034 (2013.01); H01L 24/45 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0665 (2013.01);
Abstract

An integrated circuit (IC) is provided. The IC includes a molding compound, a plurality of pins, an exposed pad, a die surrounded by the molding compound, an adhesive material, and a plurality of bonding wires. The pins are disposed on at least one edge of the molding compound and separated from each other. The adhesive material is disposed between the die and the exposed pad and surrounded by the molding compound. The exposed pad is electrically connected to the die through one of the bonding wires, and the pins are electrically connected to the die through the remaining bonding wires. The die is configured to detect whether a chassis intrusion event is present in response to a signal from the exposed pad.


Find Patent Forward Citations

Loading…