The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Sep. 25, 2020
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventors:
Kouichirou Sugai, Kyoto, JP;
Kazuki Nishimoto, Kyoto, JP;
Assignee:
KYOCERA Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 23/3735 (2013.01);
Abstract
An electronic component mounting substrate includes: a metal base including a first surface and a recessed portion having a frame-like shape, the recessed portion opening to the first surface and including a bottom surface, an inner side surface, and an outer side surface; and an insulation base plate bonded via a bonding material to a position surrounded by the recessed portion on the first surface. A protective layer is provided on the inner side surface of the recessed portion, and on the bottom surface, the protective layer extending from the inner side surface to the outer side surface is not provided.