The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Aug. 11, 2021
Applicant:
SK Enpulse Co., Ltd., Gyeonggi-do, KR;
Inventors:
Jong Wook Yun, Gyeonggi-do, KR;
Hyeyoung Heo, Gyeonggi-do, KR;
Jaein Ahn, Gyeonggi-do, KR;
Kyung Hwan Kim, Gyeonggi-do, KR;
Assignee:
SK ENPULSE CO., LTD., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/20 (2012.01); B24B 37/04 (2012.01); B24B 37/24 (2012.01); B24B 53/017 (2012.01); H01L 21/3105 (2006.01); H01L 21/321 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7684 (2013.01); B24B 37/044 (2013.01); B24B 37/20 (2013.01); B24B 37/24 (2013.01); B24B 53/017 (2013.01); H01L 21/31053 (2013.01); H01L 21/3212 (2013.01);
Abstract
The present invention provides a polishing pad, a process for preparing the same, and a process for preparing a semiconductor device using the same. In the polishing pad, the surface zeta potential and its ratio of the polishing surface are controlled to specific ranges according to the type of polishing slurry, whereby it is possible to improve the characteristics of scratches and surface defects appearing on the surface of the semiconductor substrate and to further enhance the polishing rate.