The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Apr. 28, 2023
Applicant:

Beijing Naura Microelectronics Equipment Co., Ltd., Beijing, CN;

Inventor:

Jian Liu, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01);
Abstract

An electrostatic chuck arranged in a process chamber of a semiconductor processing apparatus includes an insulation layer for carrying a wafer and an electrode assembly arranged in the insulation layer. The electrode assembly is electrically connected to a direct current (DC) power supply and a radio frequency (RF) power supply. When the DC power supply applies DC power to the electrode assembly, the electrode assembly is used to adsorb the wafer on the insulation layer. When the RF power supply applies RF power to the electrode assembly, the RF power is uniformly distributed to different positions of the insulation layer.


Find Patent Forward Citations

Liu, Jian. (2025). Electrostatic chuck and semiconductor processing apparatus (U.S. Patent No. 12362217). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12362217

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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