The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Oct. 26, 2020
Applicant:

Soitec, Bernin, FR;

Inventor:

Hugo Biard, Grenoble, FR;

Assignee:

SOITEC, Bernin, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 14/48 (2006.01); C23C 16/01 (2006.01); C23C 16/32 (2006.01); C23C 16/448 (2006.01); C23C 16/56 (2006.01); C30B 25/20 (2006.01); C30B 29/36 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02529 (2013.01); C23C 14/48 (2013.01); C23C 16/01 (2013.01); C23C 16/325 (2013.01); C23C 16/4482 (2013.01); C23C 16/56 (2013.01); C30B 25/20 (2013.01); C30B 29/36 (2013.01); H01L 21/02378 (2013.01); H01L 21/0262 (2013.01); H01L 21/02667 (2013.01); H01L 21/30625 (2013.01);
Abstract

A method for manufacturing a composite structure comprises: a) providing an initial substrate made of monocrystalline silicon carbide, b) epitaxially growing a monocrystalline silicon carbide donor layer on the initial substrate to form a donor substrate, c) implanting ions into the donor layer to form a buried brittle plane defining the donor layer, d) depositing, using liquid injection-chemical vapor deposition at a temperature below 1000° C., a carrier layer on the donor layer, the carrier layer comprising an at least partially amorphous SiC matrix, e) separating the donor substrate along the brittle plane to form an intermediate composite structure comprising the donor layer on the carrier layer f) heat treating the intermediate composite structure at a temperature of between 1000° C. and 1800° C. to crystallize the carrier layer and form the polycrystalline carrier substrate, and g) applying mechanical and/or chemical treatment(s) of the composite structure.


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