The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Apr. 14, 2021
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Yuya Ishima, Tokyo, JP;
Masaki Takahashi, Tokyo, JP;
Akira Suda, Tokyo, JP;
Takashi Suzuki, Tokyo, JP;
Hidenobu Umeda, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); G03F 7/004 (2006.01); H01B 1/22 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); G03F 7/0047 (2013.01); H01F 27/2804 (2013.01); H01F 41/041 (2013.01); H01F 2027/2809 (2013.01);
Abstract
In a photosensitive conductive paste containing photosensitive organic components, conductor powder, and quartz powder, melting of the quartz powder does not occur or is very unlikely to occur in a heat treatment step, and in the heat treatment step, it functions sufficiently to bring shrinkage rates and shrinkage behaviors of both of a conductor layer and an element body layer closer to each other when they shrink, and thus generation of voids can be inhibited when it is used for manufacturing a laminated coil component.