The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Aug. 02, 2023
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Irizo Naniwa, Fujisawa, JP;

Kenichi Murata, Ebina, JP;

Yuhsuke Matsumoto, Fujisawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/48 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
G11B 5/4846 (2013.01); G11B 5/4826 (2013.01); G11B 5/4833 (2013.01); G11B 5/4853 (2013.01); H05K 3/3452 (2013.01); G11B 2220/2516 (2013.01); H05K 2203/0582 (2013.01);
Abstract

A hard disk drive flexure assembly includes an insulative base layer over a metal substrate, a first conductive layer over the base layer, a plurality of electrical pads each comprising a second conductive layer over the first conductive layer, a pre-formed bump of solder material positioned over each pad, and a conductive cover layer over at least a portion of each pre-solder bump. With the conductive cover layer, e.g., gold, solder material from each pre-solder bump is inhibited from transferring to a probe during electrical check of the flexure, the solder material is inhibited from oxidizing, and solder splash is inhibited. These techniques are especially relevant with narrow, high-density, small pitch electrical pads.


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