The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Jan. 16, 2025
North University of China, Taiyuan, CN;
Yaqing Liu, Taiyuan, CN;
Qihui Chen, Taiyuan, CN;
Chaoyang Wu, Taiyuan, CN;
Guizhe Zhao, Taiyuan, CN;
NORTH UNIVERSITY OF CHINA, Taiyuan, CN;
Abstract
A thermal compensation design and implementation method for near-net-shape molding of a thermoset composite part based on temperature and curing degree fields is provided. A minimum symmetric unit model is established based on sizes of the part and a mold and ambient temperature. A curing kinetic model and a heat transfer model are established. A molding temperature curve is written into a subprogram. A simulated thermal compensation is performed on a region whose temperature is lower than a molding temperature with a difference of greater than or equal to 5% of the molding temperature until the temperature difference of individual regions is less than 5% of the molding temperature. The simulated thermal compensation is then performed on those regions with a curing degree less than or equal to 0.9. A thermal compensation device is assembled according to the thermal compensation scheme for experimental verification.