The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Sep. 30, 2021
Applicants:

Mianyang Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Jianfeng Zeng, Beijing, CN;

Liandong Dou, Beijing, CN;

Zihan Tang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/418 (2006.01);
U.S. Cl.
CPC ...
G05B 19/41875 (2013.01); G05B 2219/32368 (2013.01);
Abstract

A data processing method and system, and a computer-readable storage medium. The method includes: acquiring target data, the target data including data from a plurality of analysis units (); acquiring, from each of the analysis units, inspection data of a plurality of substrates to be inspected that contain defect points (); superimposing the defect points in the plurality of substrates to be inspected to obtain a data set of the defect points (); performing a clustering calculation on the data set of the defect points to obtain a first cluster set of the defect points (); and generating, based on the first cluster set of the defect points, alarm information for a device contact position corresponding to the first cluster set (). With the method, the substrates to be inspected in each analysis unit are analyzed, and a time interval between the process of production and the process of analysis of repeated defects is shortened, which is conducive to improving the data processing efficiency. Moreover, with the method, it is possible to detect the defect points that are repeatedly defective at the same position, i.e., to obtain the first cluster set of the defect points, so as to achieve the effect of timely inspection of the repeated defects caused by the production device, which is conducive to improving a production yield of the substrates to be inspected.


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