The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Jun. 26, 2020
Applicant:

Semitec Corporation, Tokyo, JP;

Inventors:

Yutaro Tabata, Tokyo, JP;

Manabu Orito, Tokyo, JP;

Tadashi Matsudate, Tokyo, JP;

Assignee:

SEMITEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 1/18 (2006.01); A61B 18/00 (2006.01); A61B 18/14 (2006.01); A61B 90/00 (2016.01); G01L 5/162 (2020.01);
U.S. Cl.
CPC ...
G01L 1/18 (2013.01); G01L 5/162 (2013.01); A61B 2018/00577 (2013.01); A61B 2018/00875 (2013.01); A61B 18/1492 (2013.01); A61B 2090/064 (2016.02);
Abstract

Provided are: a contact force sensor which has high accuracy and sensitivity and is capable of ensuring strength; and a device provided with the contact force sensor. The present invention comprises: a sensor body () manufactured by processing a semiconductor material, wherein the sensor body () is provided with: a ring-shaped portion (); a central portion () formed substantially in the center of the ring-shaped portion (); a spoke portion () connected to the ring-shaped portion () from the central portion () toward the outside; and stress-electricity conversion elements () which are disposed at positions facing each other on the front side and the back side of the spoke portion (), and convert the displacement of the spoke portion () into an electric signal.


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