The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Jul. 22, 2022
Applicant:

Dell Products, L.p., Round Rock, TX (US);

Inventors:

Vaishnavi Suchindran, Bangalore, IN;

Ravi Shekhar Singh, Bangalore, IN;

Balamurugan Gnanasambandam, Bengaluru, IN;

Assignee:

Dell Product, L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01K 1/02 (2021.01); G06F 1/20 (2006.01); G06F 11/30 (2006.01); G01D 3/00 (2006.01); G01D 3/028 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
G01K 1/026 (2013.01); G06F 1/206 (2013.01); G06F 11/3037 (2013.01); G06F 11/3058 (2013.01); G01D 3/00 (2013.01); G01D 3/028 (2013.01); H01L 23/34 (2013.01);
Abstract

Effectively reading multiple temperature sensors on memory modules may include reading a first of a plurality of temperature sensors on each memory module of a plurality of memory modules, reading a second of the plurality of temperature sensors on each memory module, after reading the first sensors on each memory module, and, if present, reading a third of the plurality of temperature sensors on each memory module of the plurality of memory modules, after reading the second of the sensors on each memory module. The first temperature sensors may be reread prior to reading the third temperature sensors, particularly where the first temperature sensors are middle temperature sensors on each memory module. Upon failing to read a particular temperature sensor, neighboring temperature sensors of the particular temperature sensor may be polled, such as (an) other temperature sensor(s) on the same memory module and/or (a) temperature sensor(s) on adjacent memory module(s).


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