The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Jul. 29, 2020
Applicant:

Nitto Denko Corporation, Ibaraki, JP;

Inventors:

Daisuke Mizuno, Ibaraki, JP;

Kensuke Tani, Ibaraki, JP;

Satoshi Honda, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/38 (2018.01);
U.S. Cl.
CPC ...
C09J 7/385 (2018.01);
Abstract

The present invention relates to a pressure-sensitive adhesive composition including a compound having a substituent represented by the general formula (1) described in the specification, in which when each of Rand Rin the substituent represented by the general formula (1) represents a hydrogen atom, a distance between an oxygen atom of —ORand an oxygen atom of —ORis 1.31 Å or more and 4.70 Å or less, a pressure-sensitive adhesive layer formed of the pressure-sensitive adhesive composition, and a pressure-sensitive adhesive sheet comprising the pressure-sensitive adhesive layer.


Find Patent Forward Citations

Mizuno, Daisuke. (2025). Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheet (U.S. Patent No. 12359099). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12359099

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…