The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Jun. 16, 2023
Applicant:

Teijin Limited, Osaka, JP;

Inventors:

Akimichi Oda, Osaka, JP;

Hiroaki Kuwahara, Osaka, JP;

Hironori Kawamoto, Osaka, JP;

Assignee:

TEIJIN LIMITED, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/50 (2006.01); C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
C08G 59/50 (2013.01); C08J 5/243 (2021.05); C08J 2363/00 (2013.01); C08J 2377/00 (2013.01); C08J 2381/06 (2013.01);
Abstract

According to the present invention, there is provided a prepreg characterized by including a reinforcing fiber substrate composed of a reinforcing fiber, and an epoxy resin composition with which the reinforcing fiber substrate is partially or wholly impregnated, in which the epoxy resin composition includes, as an essential component, an epoxy resin, an amine-based curing agent, and a polyamide particle, the epoxy resin composition includes, as an optional component, an epoxy resin-soluble thermoplastic resin; and an epoxy group is introduced to the surface of the polyamide particle, and/or at least one of the epoxy resin, the amine-based curing agent, and the epoxy resin-soluble thermoplastic resin, included in the epoxy resin composition, partially permeates into the polyamide particle.


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