The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Sep. 28, 2022
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Jeong Hyun Lee, Daejeon, KR;

Do Yeon Kim, Daejeon, KR;

Yang Gu Kang, Daejeon, KR;

Shin Hee Jun, Daejeon, KR;

Ha Na Lee, Daejeon, KR;

Ho Yeon Son, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 18/42 (2006.01); C08G 18/48 (2006.01); C08K 3/013 (2018.01); C08K 5/00 (2006.01); C08K 5/053 (2006.01);
U.S. Cl.
CPC ...
C08G 18/4277 (2013.01); C08G 18/4862 (2013.01); C08K 3/013 (2018.01); C08K 5/0016 (2013.01); C08K 2201/001 (2013.01);
Abstract

The present application relates to a resin composition or a use thereof. In the present application, it is possible to provide a resin composition or a cured body thereof that exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity. Also, in the present application, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. The present application can also provide a product comprising the curable composition or the cured body thereof.


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