The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2025
Filed:
Aug. 21, 2019
Applicant:
Amcor Flexibles North America, Inc., Neenah, WI (US);
Inventors:
Michael D. Priscal, Neenah, WI (US);
Jacob A Lasee, Neenah, WI (US);
Assignee:
Amcor Flexibles North America, Inc, Neenah, WI (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); B29C 51/14 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B65D 65/40 (2006.01); C08J 5/18 (2006.01); C08K 3/26 (2006.01); B65D 75/32 (2006.01);
U.S. Cl.
CPC ...
B65D 65/40 (2013.01); B29C 51/14 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/306 (2013.01); B32B 27/327 (2013.01); C08J 5/18 (2013.01); C08K 3/26 (2013.01); B32B 2250/03 (2013.01); B32B 2250/04 (2013.01); B32B 2250/242 (2013.01); B32B 2250/246 (2013.01); B32B 2264/10 (2013.01); B32B 2264/104 (2013.01); B32B 2307/308 (2013.01); B32B 2307/31 (2013.01); B32B 2307/4023 (2013.01); B32B 2307/558 (2013.01); B32B 2307/72 (2013.01); B32B 2435/02 (2013.01); B32B 2439/70 (2013.01); B32B 2439/80 (2013.01); B65D 75/327 (2013.01); C08J 2323/06 (2013.01); C08J 2331/04 (2013.01); C08K 2003/265 (2013.01);
Abstract
Recyclable films having at least a first layer containing a high-density polyethylene and a nucleating agent, a second layer containing a high-density polyethylene and a third layer containing a high-density polyethylene and a nucleating agent may be used for thermoforming packaging components. The film structure is advantageous as it can be more easily thermoformed that traditional high-density polyethylene films and can maintain the shape taken during thermoforming, exhibiting minimal warping or shrinking.