The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Mar. 22, 2022
Applicants:

Xerox Corporation, Norwalk, CT (US);

National Research Council of Canada, Ottawa, CA;

Inventors:

Sarah J. Vella, Milton, CA;

Alexandros Vasileiou, Toronto, CA;

Yujie Zhu, Mississauga, CA;

Edward G. Zwartz, Mississauga, CA;

Chantal Paquet, Ottawa, CA;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/118 (2017.01); B29C 48/05 (2019.01); B29C 64/10 (2017.01); B29C 64/165 (2017.01); B29C 64/314 (2017.01); B29C 64/40 (2017.01); B33Y 10/00 (2015.01); B33Y 40/10 (2020.01); B33Y 70/10 (2020.01); B33Y 80/00 (2015.01); C08L 23/06 (2006.01); C08L 25/06 (2006.01); C08L 53/02 (2006.01); C08L 67/04 (2006.01); C08L 71/02 (2006.01); C09D 4/06 (2006.01); C09D 5/24 (2006.01); C09D 7/40 (2018.01); C09D 7/61 (2018.01); C09D 7/62 (2018.01); C09D 7/63 (2018.01); C09D 167/04 (2006.01); H10N 30/092 (2023.01); H10N 30/85 (2023.01); B29K 25/00 (2006.01); B29K 33/00 (2006.01); B29K 67/00 (2006.01); B29K 101/12 (2006.01); B29K 105/00 (2006.01); B29K 105/04 (2006.01); B29K 105/16 (2006.01); B29K 507/04 (2006.01); B29K 509/00 (2006.01); B29K 509/02 (2006.01); C08K 3/04 (2006.01); C08K 3/22 (2006.01); C08K 7/06 (2006.01); C08K 9/04 (2006.01);
U.S. Cl.
CPC ...
B29C 64/118 (2017.08); B29C 48/05 (2019.02); B29C 64/10 (2017.08); B29C 64/165 (2017.08); B29C 64/314 (2017.08); B29C 64/40 (2017.08); B33Y 10/00 (2014.12); B33Y 40/10 (2020.01); B33Y 70/10 (2020.01); B33Y 80/00 (2014.12); C08L 23/06 (2013.01); C08L 25/06 (2013.01); C08L 53/02 (2013.01); C08L 67/04 (2013.01); C08L 71/02 (2013.01); C09D 4/06 (2013.01); C09D 5/24 (2013.01); C09D 7/61 (2018.01); C09D 7/62 (2018.01); C09D 7/63 (2018.01); C09D 7/69 (2018.01); C09D 7/70 (2018.01); C09D 167/04 (2013.01); H10N 30/092 (2023.02); H10N 30/852 (2023.02); B29K 2025/08 (2013.01); B29K 2033/08 (2013.01); B29K 2033/12 (2013.01); B29K 2067/00 (2013.01); B29K 2067/04 (2013.01); B29K 2101/12 (2013.01); B29K 2105/002 (2013.01); B29K 2105/0023 (2013.01); B29K 2105/0088 (2013.01); B29K 2105/04 (2013.01); B29K 2105/16 (2013.01); B29K 2105/162 (2013.01); B29K 2507/04 (2013.01); B29K 2509/00 (2013.01); B29K 2509/02 (2013.01); B29K 2995/0003 (2013.01); B29K 2995/0005 (2013.01); B29K 2995/0077 (2013.01); C08K 3/04 (2013.01); C08K 2003/2234 (2013.01); C08K 2003/2237 (2013.01); C08K 2003/2244 (2013.01); C08K 7/06 (2013.01); C08K 9/04 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); C08K 2201/011 (2013.01); C08L 2207/04 (2013.01); C08L 2207/062 (2013.01);
Abstract

Parts made by additive manufacturing are often structural in nature, rather than having functional properties conveyed by a polymer or other component. Printed parts having piezoelectric properties may be formed using compositions comprising a plurality of piezoelectric particles non-covalently interacting with at least a portion of a polymer material via π-π bonding, hydrogen bonding, electrostatic interactions stronger than van der Waals interactions, or any combination thereof. The piezoelectric particles may be dispersed in the polymer material and remain substantially non-agglomerated when combined with the polymer material. The polymer material may comprise at least one thermoplastic polymer, optionally further including a polymer precursor. The compositions may define an extrudable material that is a composite having a form factor such as a composite filament, a composite pellet, a composite powder, or a composite paste. Additive manufacturing processes using the compositions may comprise forming a printed part by depositing the compositions layer-by-layer.


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