The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Nov. 13, 2023
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Toshimitsu Nagoya, Kanagawa, JP;

Kei Oikawa, Kanagawa, JP;

Makoto Kojima, Kanagawa, JP;

Takahiro Suzuki, Tokyo, JP;

Mao Mukaida, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/26 (2006.01); B29C 45/02 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/263 (2013.01); B29C 45/02 (2013.01); B29K 2995/0094 (2013.01); B29L 2031/722 (2013.01); B29L 2031/764 (2013.01); B29L 2031/767 (2013.01);
Abstract

A molded resin product includes a plurality of protrusions formed in a predetermined region. A histogram indicating a height distribution of the plurality of protrusions has two peaks having a boundary height as a boundary therebetween. In a case where protrusions having height equal to or smaller than the height Hx are first protrusions and protrusions having height larger than the boundary height are second protrusions among the plurality of protrusions, an arithmetic mean curvature of the first protrusions is smaller than an arithmetic mean curvature of the second protrusions.


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