The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Jun. 28, 2019
Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventors:

Kazuhiro Yoshida, Tokyo, JP;

Yoshinao Komatsu, Tokyo, JP;

Saneyuki Goya, Tokyo, JP;

Akiko Inoue, Tokyo, JP;

Yasuyuki Fujiya, Tokyo, JP;

Ryuichi Narita, Tokyo, JP;

Masahiko Shimizu, Tokyo, JP;

Ryota Ozaki, Tokyo, JP;

Yuki Kani, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/364 (2014.01); B23K 26/082 (2014.01); B23K 26/14 (2014.01); B23K 26/142 (2014.01);
U.S. Cl.
CPC ...
B23K 26/364 (2015.10); B23K 26/142 (2015.10); B23K 26/1476 (2013.01); B23K 26/082 (2015.10);
Abstract

A laser machining device includes: a laser irradiation unit that forms a machining groove that has one end opening to an end section of a workpiece and the other end thereof closed, as a result of scanning a workpiece surface from an end section of the workpiece and laser machining the workpiece; and a nozzle unit that sprays a gas across an irradiation zone of the workpiece surface created by the laser irradiation unit. The nozzle unit is configured so as to increase the flowrate of the gas supplied to the irradiation zone, from one end to the other end of the machining groove.


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