The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Nov. 21, 2024
Applicant:

State Grid Jiangsu Electric Power Co., Ltd. Marketing Center, Jiangsu, CN;

Inventors:

Qifeng Huang, Jiangsu, CN;

Qing Xu, Jiangsu, CN;

Siyun Wang, Jiangsu, CN;

Zhixin Li, Jiangsu, CN;

Xiao Chen, Jiangsu, CN;

Zhongdong Wang, Jiangsu, CN;

Mingming Chen, Jiangsu, CN;

Yongxian Yi, Jiangsu, CN;

Guofang Xia, Jiangsu, CN;

Jin Bao, Jiangsu, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 60/00 (2023.01); H10N 60/12 (2023.01); H10N 69/00 (2023.01);
U.S. Cl.
CPC ...
H10N 69/00 (2023.02); H10N 60/12 (2023.02);
Abstract

Provided are a heat shield and a Josephson junction array chip system, the heat shield includes a cryostat, a sensor group, a radiation shield plate, a clamp assembly, and a vacuum shield cover assembly; the cryostat includes a cold head, a first-stage chassis, and a second-stage chassis; the vacuum shield cover assembly includes a first vacuum shield cover, a second vacuum shield cover, and a heat shield aluminum oxide layer; and the cold head is located in the first vacuum shield cover; and the heat shield aluminum oxide layer is coated on a surface of at least one of the first vacuum shield cover or the second vacuum shield cover; the clamp assembly on the radiation shield plate is configured to fix the Josephson junction array chip; and the sensor group adjacent to the Josephson junction array chip is arranged on the radiation shield plate.


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