The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Dec. 27, 2018
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Peter Smeys, San Jose, CA (US);

Mohammad Hadi Motieian Najar, Santa Clara, CA (US);

Ting-Ta Yen, San Jose, CA (US);

Ahmad Bahai, Lafayette, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 30/88 (2023.01); H04R 1/40 (2006.01); H04R 17/00 (2006.01); H04R 17/02 (2006.01); H04R 31/00 (2006.01); H10N 30/20 (2023.01); H10N 30/30 (2023.01); H10N 30/85 (2023.01); H10N 30/87 (2023.01); H10N 39/00 (2023.01);
U.S. Cl.
CPC ...
H10N 30/883 (2023.02); H04R 1/403 (2013.01); H04R 17/00 (2013.01); H10N 30/20 (2023.02); H10N 30/30 (2023.02); H10N 30/872 (2023.02); H10N 39/00 (2023.02); H04R 17/02 (2013.01); H04R 31/00 (2013.01); H10N 30/85 (2023.02); H10N 30/877 (2023.02);
Abstract

In one example, a semiconductor device includes an acoustic medium, a first transducer on the acoustic medium, a first electrode coupled to the first transducer, a second transducer on the acoustic medium, and a second electrode coupled to the second acoustic transducer. The semiconductor device also includes a semiconductor substrate to support the acoustic medium and first and second transducers. Mold compound encapsulates at least a portion of the acoustic medium, the first acoustic transducer, the second acoustic transducer, and the semiconductor substrate.


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