The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Sep. 30, 2020
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventor:

Masaya Nagata, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H10F 39/811 (2025.01); H01L 24/05 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H10F 39/804 (2025.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13666 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/19 (2013.01); H01L 2224/211 (2013.01); H01L 2224/214 (2013.01); H01L 2224/215 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01079 (2013.01);
Abstract

An imaging device to which a simple mounting method can be applied is configured. The imaging device is provided with an imaging element, a wiring substrate, and a sealing portion. The imaging element is provided with an image pickup chip over which an light transmitting portion transmitting incident light is arranged and which generates an image signal on the basis of the incident light that has passed through the light transmitting portion, and a pad which is arranged on a bottom surface of the image pickup chip different from a surface on which the light transmitting portion is arranged, which the pad transmitting the generated image signal. The wiring substrate has wiring connected to the pad and extending to a region outside the imaging element, and has the imaging element arranged on a surface thereof. The sealing portion is arranged adjacent to a side surface which is a surface adjacent to the bottom surface of the imaging element, and seals the imaging element.


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