The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Oct. 23, 2019
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Hironori Hoshi, Kanagawa, JP;

Atsushi Okuyama, Kanagawa, JP;

Itaru Oshiyama, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/12 (2025.01); H10F 39/00 (2025.01); H10F 39/18 (2025.01);
U.S. Cl.
CPC ...
H10F 39/8057 (2025.01); H10F 39/024 (2025.01); H10F 39/182 (2025.01); H10F 39/199 (2025.01); H10F 39/8063 (2025.01);
Abstract

The present disclosure relates to an image capturing element, a manufacturing method, and an electronic device that make it possible to improve effects of reducing crosstalk. A trench part provided from a light-receiving surface side of a semiconductor substrate in which photoelectric conversion parts that photoelectrically convert emitted light are formed and between the plurality of photoelectric conversion parts; and a protrusion part provided with at least an inclined surface that is inclined with respect to a side surface of the trench part to widen a space of the trench part in one part of the trench part are provided. The present technology can be applied, for example, to backlit solid-state image capturing elements.


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