The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Sep. 30, 2020
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Mutsuo Tsuji, Kanagawa, JP;

Daisuke Chino, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); H01L 23/14 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H10F 39/80 (2025.01); H01L 23/14 (2013.01); H01L 23/31 (2013.01);
Abstract

An imaging apparatus includes an imaging element, a wiring substrate, a sealing section, and fitting sections. The imaging element includes an imaging chip and pads. A light transmission section that transmits incident light is arranged on the imaging chip, and the imaging chip generates an image signal based on the incident light that has transmitted through the light transmission section. The pads are arranged on a bottom surface of the imaging chip which is a surface different from the surface on which the light transmission section is arranged and convey the generated image signal. The wiring substrate includes wiring that is connected to the pads, and the imaging element is arranged on a front surface of the wiring substrate. The sealing section is arranged adjacent to side surfaces of the imaging chip which are the surfaces adjacent to the bottom surface of the imaging chip and seals the imaging chip.


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