The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Sep. 17, 2021
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Tomoaki Noguchi, Tokyo, JP;

Yosuke Nakanishi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 64/62 (2025.01); H01L 21/04 (2006.01); H02P 27/08 (2006.01); H10D 12/01 (2025.01); H10D 30/66 (2025.01); H10D 62/832 (2025.01);
U.S. Cl.
CPC ...
H10D 64/62 (2025.01); H01L 21/0485 (2013.01); H02P 27/08 (2013.01); H10D 12/031 (2025.01); H10D 30/669 (2025.01); H10D 62/8325 (2025.01);
Abstract

The object of a silicon carbide semiconductor device according to the present disclosure is to prevent fluctuations in threshold voltage and prevent cracks in a barrier metal. A silicon carbide semiconductor device includes: a silicon carbide substrate; a semiconductor layer formed on the silicon carbide substrate; a gate electrode facing the semiconductor layer through a gate insulating film; an interlayer insulating film covering the gate electrode; a barrier metal formed on the interlayer insulating film; and a top electrode covering the barrier metal, wherein the barrier metal has a two-layer structure of a barrier metal and a barrier metal, and the barrier metal closer to the interlayer insulating film is made of a same metallic material as the barrier metal, the barrier metal being thinner than the barrier metal.


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