The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Jun. 29, 2022
Applicant:

Amazon Technologies, Inc., Seattle, WA (US);

Inventors:

Gregory Cartagena, New York, NY (US);

Dincer Bozkaya, Andover, MA (US);

Sara Jean Woo, Andover, MA (US);

Caroline Anne Keely, Wakefield, MA (US);

Assignee:

Amazon Technologies, Inc., Seattle, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/52 (2023.01); G02B 7/02 (2021.01); H04N 13/239 (2018.01); H04N 23/45 (2023.01); H04N 23/51 (2023.01); H04N 23/55 (2023.01);
U.S. Cl.
CPC ...
H04N 23/45 (2023.01); G02B 7/028 (2013.01); H04N 13/239 (2018.05); H04N 23/51 (2023.01); H04N 23/52 (2023.01); H04N 23/55 (2023.01);
Abstract

Techniques and apparatus for mechanical assembly of an imaging device are described. An example image sensor assembly disposed within an imaging device includes a circuit board, an image sensor disposed on the circuit board, and an optics holder. The optics holder includes a support location, a thermally conductive material, and a plurality of extended surfaces that extend outward in a direction away from the circuit board. Each of the plurality of extended surfaces includes the thermally conductive material. The image sensor assembly also includes an optical lens disposed in the support location of the optics holder. The circuit board is disposed between the optics holder and a housing of the imaging device.


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