The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2025

Filed:

Mar. 14, 2023
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Motoji Tsuda, Kyoto, JP;

Yukiya Yamaguchi, Kyoto, JP;

Takanori Uejima, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/00 (2006.01); H04B 1/04 (2006.01);
U.S. Cl.
CPC ...
H04B 1/0078 (2013.01); H04B 1/0458 (2013.01); H04B 2001/0408 (2013.01);
Abstract

A radio-frequency module includes a first base, which has at least a part formed of a first semiconductor material and which includes a low-noise amplifier circuit, a second base, which has at least a part formed of a second semiconductor material having a thermal conductivity lower than that of the first semiconductor material and which includes a power amplifier circuit, and a module substrate, which has a principal surface on which the first base and the second base are disposed. The first base is joined to the principal surface with electrodes interposed in between. The second base is disposed between the module substrate and the first base in cross-sectional view, and is joined to the principal surface with an electrode interposed in between. At least a part of the first base overlaps at least a part of the second base in plan view.


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