The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Sep. 08, 2022
Kioxia Corporation, Tokyo, JP;
Masayuki Miura, Tokyo, JP;
Kioxia Corporation, Tokyo, JP;
Abstract
A semiconductor device includes: a wiring substrate in which a wiring layer is provided; a first semiconductor chip that is provided above the wiring substrate and on a surface of which a first pad is formed, the surface being on a side closer to the wiring substrate; a second semiconductor chip that is provided on the first semiconductor chip through a first resin layer and on a surface of which a second pad is formed, the surface being on a side opposite the wiring substrate; a third semiconductor chip that is provided on the second semiconductor chip through a second resin layer and on a surface of which a third pad is formed, the surface being on the side closer to the wiring substrate; and a first wire connecting the first pad and the third pad; and a second wire connecting the second pad and the wiring substrate.