The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Feb. 24, 2020
Corning Incorporated, Corning, NY (US);
Jin Su Kim, Seoul, KR;
Yu Xiao, Pittsford, NY (US);
CORNING INCORPORATED, Corning, NY (US);
Abstract
A wafer- or panel-level encapsulated package comprises a glass substrate comprising a glass cladding layer () fused to a glass core layer (), the glass substrate comprising a cavity (), wherein the glass cladding layer has a higher etch rate in an etchant than the glass core layer. The wafer- or panel-level encapsulated package further comprises a microelectronic component () disposed in the cavity, and an encapsulant () sealed to the glass substrate such that the microelectronic component is encapsulated within the cavity. Methods for forming the wafer- or panel-level encapsulated package, including etching a cavity into a glass substrate, depositing a microelectronic component into the cavity, and sealing an encapsulant to the glass substrate such that the microelectronic component is encapsulated within the cavity are also provided.