The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
Apr. 27, 2022
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Pradeep K. Subrahmanyan, Cupertino, CA (US);
Sean S. Kang, San Ramon, CA (US);
Sony Varghese, Manchester, MA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G03F 7/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); G03F 7/70633 (2013.01); G03F 7/7065 (2013.01); H01L 22/12 (2013.01);
Abstract
Provided are methods of reducing the stress of a semiconductor wafer. A wafer map of a free-standing wafer is created using metrology tools. The wafer map is then converted into a power spectral density (PSD) using a spatial frequency scale. The fundamental component of bow is then compensated with a uniform film, e.g., silicon nitride (SiN), deposited on the back side of the wafer.